articleTop 10% cited
Copper interconnections and reliability
Materials Chemistry and Physics · 1998 · Vol. 52(1) · pp. 5–16
C.‐K. Hu✉(IBM Research - Thomas J. Watson Research Center)J. M. E. Harper(IBM Research - Thomas J. Watson Research Center)
Copper Interconnects and ReliabilitySemiconductor materials and devicesElectronic Packaging and Soldering TechnologiesElectromigrationCopper interconnectCopperPlanarity testingPolyimideReliability (semiconductor)Materials scienceInterconnectionConductivityChip
Citations
280
FWCI
9.58
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References
41
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99%
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Citations per year
References
Introduction to Solid State Physics
American Journal of Physics · 1957 · 22,357 citations
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