Electronic Packaging and Soldering Technologies

This cluster of papers focuses on the advances and challenges in the use of lead-free solders, interfacial reactions between solders and base materials, reliability studies in electronic packaging, high-temperature electronics, nanoparticle applications, electromigration effects, thermal behavior, rare earth element additions, and the use of conductive adhesives as alternatives.

Journals publishing in this area

1

International Journal of Electronics and Microcircuits

ISSN 2708-44934 articles in this topic

1h-index

0.11Impact

40Articles

4Citations