Copper Interconnects and Reliability

This cluster of papers focuses on the development and characterization of low dielectric constant (low-k) materials for microelectronics, with an emphasis on their application in copper metallization and interconnect scaling. The papers cover topics such as electromigration, thin films, plasma processing, diffusion barriers, and the electrical resistivity of nanowires.

Journals publishing in this area

1

Thin Solid Films

ISSN 0040-60903,172 articles in this topic

251h-index

2.20Impact

47.3KArticles

1.1MCitations

2

Journal of The Electrochemical Society

ISSN 0013-46511,884 articles in this topic

416h-index

3.12Impact

55.6KArticles

2.1MCitations

3

Surface and Coatings Technology

ISSN 0257-89721,049 articles in this topic

223h-index

5.86Impact

31.6KArticles

992.6KCitations

4

Journal of materials research/Pratt's guide to venture capital sources

ISSN 0884-1616491 articles in this topic

210h-index

2.18Impact

16.1KArticles

485.2KCitations