Scinovex
articleTop 1% cited

Physical mechanisms contributing to enhanced bipolar gain degradation at low dose rates

IEEE Transactions on Nuclear Science · 1994 · Vol. 41(6) · pp. 1871–1883
Daniel M. FleetwoodS.L. KosierR.N. NowlinRonald D. SchrimpfR.A. ReberM. DeLausP.S. WinokurA. WeiW.E. CombsR.L. Pease

Abstract

We have performed capacitance-voltage (C-V) and thermally-stimulated-current (TSC) measurements on non-radiation-hard MOS capacitors simulating screen oxides of modern bipolar technologies. For O-V irradiation at /spl sim/25/spl deg/C, the net trapped-positive-charge density (N/sub ox/) inferred from midgap C-V shifts is /spl sim/25-40% greater for low-dose-rate (<10 rad(SiO/sub 2/)/s) than for high-dose-rate (>100 rad(SiO/sub 2/)/s) exposure. Device modeling shows that such a difference in screen-oxide N/sub ox/ is enough to account for the enhanced low-rate gain degradation often observed in bipolar devices, due to the /spl sim/exp(N/sub ox//sup 2/) dependence of the excess base current. At the higher rates, TSC measurements reveal a /spl sim/10% decrease in trapped-hole density over low rates. Also, at high rates, up to /spl sim/2.5-times as many trapped holes are compensated by electrons in border traps than at low rates for these devices and irradiation conditions. Both the reduction in trapped-hole density and increased charge compensation reduce the high-rate midgap shift. A physical model is developed which suggests that both effects are caused by time-dependent space charge in the bulk of these soft oxides associated with slowly transporting and/or metastably trapped holes (e.g. in E/sub /spl delta//' centers). On the basis of this model, bipolar transistors and screen-oxide capacitors were irradiated at 60/spl deg/C at 200 rad(SiO/sub 2/)/s in a successful effort to match low-rate damage. These surprising results provide insight into enhanced low-rate bipolar gain degradation and suggest potentially promising new approaches to bipolar and BiCMOS hardness assurance for space applications.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>

Semiconductor materials and devicesAdvancements in Semiconductor Devices and Circuit DesignIntegrated Circuits and Semiconductor Failure AnalysisIrradiationMaterials scienceCapacitanceCapacitorSpace chargeCurrent densityBipolar junction transistorAnalytical Chemistry (journal)OptoelectronicsOxide
Citations
281
FWCI
16.91
field-weighted impact
References
55
Percentile
100%
vs. same field & year
Citations per year
Cited by
Total ionizing dose effects in MOS oxides and devices
IEEE Transactions on Nuclear Science · 2003 · 905 citations
Total Ionizing Dose Effects in MOS and Low-Dose-Rate-Sensitive Linear-Bipolar Devices
IEEE Transactions on Nuclear Science · 2013 · 357 citations
References
Correlating the Radiation Response of MOS Capacitors and Transistors
IEEE Transactions on Nuclear Science · 1984 · 415 citations
The nature of the trapped hole annealing process
IEEE Transactions on Nuclear Science · 1989 · 309 citations
Physical Mechanisms Contributing to Device "Rebound"
IEEE Transactions on Nuclear Science · 1984 · 358 citations
'Border traps' in MOS devices
IEEE Transactions on Nuclear Science · 1992 · 342 citations
Response of advanced bipolar processes to ionizing radiation
IEEE Transactions on Nuclear Science · 1991 · 319 citations
Citation Network

How this paper connects to the literature. Drag to explore, click any node to open that paper.