articleTop 10% cited
Enhanced thermal conductivity of polymer composites filled with hybrid filler
Composites Part A Applied Science and Manufacturing · 2005 · Vol. 37(5) · pp. 727–734
Geon-Woong Lee✉(Korea Institute of Science and Technology)Min Park(Korea Institute of Science and Technology)Junkyung Kim(Korea Institute of Science and Technology)Jae Ik Lee(Korea University)Ho Gyu Yoon(Korea University)
Thermal properties of materialsEpoxy Resin Curing ProcessesAdvanced ceramic materials synthesisMaterials scienceComposite materialFiller (materials)Thermal conductivityBoron nitrideSilicon carbideWhiskerComposite numberThermal expansionMicroelectronics
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References
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